2013年7月18日星期四

What is GaAs?

GaAs(Gallium arsenide) is a compound semiconductor material,a mixture of two elements, gallium (Ga) and arsenic (As). The uses of Gallium arsenide are varied and include being used in LED/LD, field-effect transistors (FETs), and integrated circuits (ICs).
GaAs Basic Parameters at 300K
Crystal structureZinc Blende
Group of symmetryTd2-F43m
Number of atoms in 1 cm34.42·1022
de Broglie electron wavelength240 A
Debye temperature360 K
Density5.32 g cm-3
Dielectric constant (static )12.9
Dielectric constant (high frequency)10.89
Effective electron mass me0.063mo
Effective hole masses mh0.51mo
Effective hole masses mlp0.082mo
Electron affinity4.07 eV
Lattice constant5.65325 A
Optical phonon energy0.035 eV
GaAs Electrical Parameters
Breakdown field≈4·105 V/cm
Mobility electrons≤8500 cm2 V-1s-1
Mobility holes≤400 cm2 V-1s-1
Diffusion coefficient electrons≤200 cm2/s
Diffusion coefficient holes≤10 cm2/s
Electron thermal velocity4.4·105 m/s
Hole thermal velocity1.8·105m/s
And now we introduce types of uses of GaAs based devices:
Types and Uses of GaAs Electronic Devices
Electronic devicesMaterial(layer/substrate)Application Technology TendsMaterial Required
Digital ICGaAs/GaAs Ultra-high-speed computersHigh level of integration 
(MESFETHEMT)GaAlAs/GaAsPC,ATM,Image Processing Low operating voltage 
Microvave DevicesGaAs/GaAsMobile communications, satellite broadcastingHigh power, low noise,Low cost
(MESFETHEMT,GaAlAs/GaAsLow-noise receiver, amplifiedHigh level of integrationLarge diameter
Simulation GaAlAs/InGaAs/GaAsAutomotive anti-collision system Low operating voltageLow Vth 
ICMMICHBT)InGaP/GaAs/GaAsPAR  
Hall devicesGaAs/GaAsAuto VTRHigh sensitivityLow cost,large diameter
FDD sensors
Position detection sensor
Types and Uses of GaAs Optoelectronic Devices
Optoelectronic devicesMaterial(layer/substrate)ApplicationTechnology TendsMaterial Required
Visible Light LEDGaAsP/GaAs( red )                      
GaAlAs/GaAs(high brightness red)  
InGaAlP/GaAs(high brightness 
orange/yellow)
Home appliances, DA, electronic equipment High brightnessLow costs
Car lightsShort wavelengthLarge diameter 
Lights in fax  
IR LEDGaAs/GaAs                                       
GaAlAs/GaAs
Home appliances,DA 
machinery in Electronics industry High power  
Remote control and optocoupler  
Optical circuit breaker  
Semiconductor LaserGaAs/GaAsOptical communication switch  
Short Wavelength LDGaAlAs/GaAs(780nm)        
 InGaAlP/GaAs(680630nm)
 Light-emitting devices for Optical LAN,light emitting devices for testing equipments,CD,MD,Laser printer,CD-Rom,DVD-Rom,DVD-RAMHigh Power,high level of integration,low wavelengthLow density,large diameter,low cost
Solar CellGaAs/GaAsSatellite broadcasting, communications,Unmanned meteorological stations 

2013年7月8日星期一

What is GaN?

GaN(Gallium nitride), which is a compound semiconductor,it is a hard, high melting point materials, the melting point of about 1700 ° C, GaN is a high degree of ionization of III-Vcompound (0.5 or 0.43). At atmospheric pressure, the GaN crystal is generally hexagonal wurtzite structure. In a cell four atoms, the atomic volume is about half that of the GaAs. GaN is Non-Toxic.

Basic Parameters for Wurtzite crystal structure at 300K:

Breakdown field
~5 x 106 V cm-1
Mobility electrons
=< 1000 cm2 V-1 s-1
Mobility holes
=< 200 cm2 V-1 s-1
Diffusion coefficient electrons
25 cm2 s-1
Diffusion coefficient holes
5 cm2 s-1
Diffusion coefficient holes
2.6 x 105 m s-1
Diffusion coefficient holes
9.4 x 104 m s-1
Breakdown field
3.3 x 106 V cm-1
Conductivity σ
6÷12 Ω-1 cm-1
Mobility electrons μn
=< 440 cm2 V-1 s-1

Physical properties:
GaN is  stable bandgap semiconductor material with heat capacity and thermal conductivity.It can be deposited in thin film on sapphire or SiC. GaN can de doped with silicon or undoped to n-type and with magnesium to p-type. 

Growth Methods:

GaN substrate is grown by MBE,MOCVD, HVPE.

Types:


Application:

It can be used to emit brilliant light in the form of light emitting diodes (LEDs) and laser diodes, as well as being the key material for next generation high frequency, high power transistors capable of operating at high temperatures.For example, GaN is the substrate which makes violet (405 nm) laser diodes possible, without use of nonlinear optical frequency-doubling. 

Manufacturer for reference:

PAM-XIAMEN is the world’s leading developer of solid-state lighting technology,he offer a full line: Freestanding GaN, GaN epitaxy on Sapphire.GaN based epitaxial wafer (LED Wafer) for LED.

SORAA:produce GaN on GaN LEDs

2013年7月5日星期五

PAM-XIAMEN Offers Larger Free-Standing Semi-Insulating GaN Substrates

Xiamen Powerway Advanced Material Co.,Ltd., a leading supplier of ultra-high purity crystalline gallium nitride (GaN) and aluminum gallium nitride (AlGaN) materials and other related products and services announced the new availability of 2" size native semi-insulating GaN (SI GaN) substrates,which is on mass production in 2011. This new product represents a natural addition to PAM-XIAMEN's native SI GaN substrate product line, which also includes 10mm x 10mm,25mm x 25mm and 38mm x 38mm substrates.
Dr. Shaka, said, "We are pleased to offer larger native SI gallium nitride(GaN) to our customers including many who are developing better and more reliable high frequency high power GaN transistors. Our 50mm dia.native SI GaN product has excellent resistivity properties just like our smaller SI GaN substrates, as corroborated by recent electrical resistivity mapping measurements carried out. The larger size and availability improve our native SI GaN boule growth and wafering processes." and "Our customers can now benefit from the increased device yield expected when developing advanced transistors on a larger square substrate. Our larger square SI GaN substrates are natural by products of our ongoing efforts,  currently we are devoted to continuously develop round three-inch and four-inch native SI GaN substrates."
PAM-XIAMEN's improved SI GaN product line has benefited from strong tech. support from Native University and Laboratory Center.

About Xiamen Powerway Advanced Material Co., Ltd

Found in 1990,Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of compound semiconductor material in China. PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices. PAM-XIAMEN's technologies enable higher performance and lower cost manufacturing of semiconductor wafer.
In 2001,PAM-XIAMEN has been involved in GaN research.In 2009,PAM-XIAMEN has been mass production for GaN epitaxy on Sapphire and freestanding GaN single crystal wafer substrate which is for UHB-LED and LD. Grown by hydride vapour phase epitaxy (HVPE) technology,PAM-XIAMEN's GaN wafer has low defect density and less or free macro defect density.Currently PAM-XIAMEN can offer low defect density native (free-standing) GaN in customer-defined orientation including polar (c-plane Ga-face or N-face) and non-polar (a-plane and m-plane), GaN and AlN templates grown on sapphire and Si or SiC substrates, and ultra-high purity polycrystalline GaN.

About GaN

GaN(Gallium nitride), which is a compound semiconductor, it is a hard, high melting point materials, the melting point of about 1700 ° C, GaN is a high degree of ionization of III-Vcompound (0.5 or 0.43). At atmospheric pressure, the GaN crystal is generally hexagonal wurtzite structure. In a cell four atoms, the atomic volume is about half that of the GaAs. If you need more information about GaN, please visit: http://www.powerwaywafer.com/What-is-GaN.html 

2013年7月3日星期三

PAM-XIAMEN Offers InGaN Substrates

Xiamen Powerway Advanced Material Co.,Ltd (PAM-XIAMEN), the leading developer and supplier of compound semiconductor crystal and wafer, today announces availability of InGaN substrate materials. InGaN is the key compound semiconductor material used for the fabrication of blue, green, and white light emitting diodes (LEDs),GaN-based ultra violet (UV), bblue laser diodes (LDs) and solar photovoltaic application. Indium gallium nitride is as the light-emitting layer for these light-emitting devices and determine device efficiency, light output power and lifetime. InGaN substrates are needed for InGaN-based device epitaxial structures and to improve device performance.
“Our success of  the InGaN material expend our nitride business,and move forward to the LED and solid-state lighting market fastly,” said Dr. Shaka “Now we are second manfuacturer to offer InGaN template after TDI,we will continue to offer this material to our current customers for green light LED application, our continuous research would focus on solid state lighting application,of course we will expend new customers for other application.”
“Now we can offer wide range nitirde semiconductor materials,including GaN, InGaN, InN, and AlN epi wafer with a wide range of deposition rates, various doping levels, wide composition ranges, and low defect densities, to meet our various customer's requests,including researcher and device foundry",added Victor Chan, a senior marketing manager for the company.
The Product
New substrates consist of an InGaN layer deposited on 2-inch GaN/sapphire template. In content in the InGaN layers ranges from 10 % to 40 %. Targeted applications are high brightness UV, blue, and green light emitting devices including light emitting diodes and, potentially, blue and green laser diodes. Currently InGaN template substrates are available in limited quantities. Available InGaN thickness:100-300nm.
Crystal Quality:Our side technology sector to the XRD data of a reference in InGaN as follows: (4um of GaN growth on the Template InGaN)
50nm InGaN, 20% In composition, the rocking curve FMHW (00.2) ~ 460 arcsecs (10.2) to 610 arcsecs(Test equipment is a Bruker D8 high-resolution X-ray diffraction).But please note that of InGaN XRD data strongly depends on the thickness, the thickness of 200nm, of InGaN crystalline quality would be higher.Though the Raman data is also a measure of crystal quality, but less accuracy than the XRD precision, so we generally measure the quality of the crystal without Raman test.
Crystal Structure:
InGaN  100nm-300nm  
4um GaN  4um  
Sapphire  430um 

Crystal Picture:
 
About Xiamen Powerway Advanced Material Co., Ltd
 
Found in 1990,Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of compound semiconductor material in China. PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices. PAM-XIAMEN's technologies enable higher performance and lower cost manufacturing of semiconductor wafer.
In 2001,PAM-XIAMEN has been involved in GaN material research.PAM-XIAMEN now offer  GaN, InGaN, InN, and AlN epitaxial products with a wide range of deposition rates, various doping levels, wide composition ranges, and low defect densities.
If you need more information about InGaN, please visit: http://www.powerwaywafer.com/GaN-Templates.html 

2013年6月24日星期一

Detail Application of Silicon Carbide

Because of SiC physical and electronic properties,silicon carbide based device are well suitable for short wavelength optoelectronic, high temperature, radiation resistant, and high-power/high-frequency electronic devices,compared with Si and GaAs based device.
 
Many researchers know the general SiC application:III-V Nitride Deposition;Optoelectronic Devices;High Power Devices;High Temperature Devices;High Frequency Power Devices.But few people knows detail applications, here we list some detail application and make some explanations:
 
 
1.SiC substrate for X-ray monochromators:such as,using SiC's large d-spacing of about 15 A;
 
2.SiC substrate for high voltage devices;
 
3.SiC substrate for diamond film growth by microwave plasma-enhanced chemical vapor deposition;
 
4.For silicon carbide p-n diode;
 
5.SiC substrate for optical window: such as for very short (< 100 fs) and intense (> 100 GW/cm2) laser pulses with a wavelength of 1300 nm. It should have a low absorption coefficient and a low two photon absorption coefficient for 1300 nm.  
 
6.SiC substrate for heat spreader: For example,the Silicon carbide crystal will be capillary bonded on a flat gain chip surface of VECSEL (Laser) to remove the generated pump heat. Therefore, the following properties are important: 
1)Semi-insulating type required to prevent free carrier absorption of the laser light;

2) Double side polished are preferred;

3)Surface roughness:  < 2nm, so that the surface is enough flat for bonding;

7.SiC substrate for THz system application: Normally it require THz transparency

8.SiC substrate for epitaxial graphene on SiC:Graphene epitaxy on off axis substrate and on axis are both available, surface side on C-face or Si face are both available.

 9.SiC substrate for process development loke ginding, dicing and etc

10.SiC substrate for fast photo-electric switch

11.SiC substrate for heat sink: thermal conductivity and thermal expansion are concerned.

12.SiC substrate for laser: optical, surface and stranparence  are concerned.

13.SiC substrate for III-V epitaxy, normally off axis substrate are required.

Xiamen Powerway Advanced Material Co.,Limited is an expert in SiC substrate, he can give researchers suggestions in different application.

2013年6月17日星期一

P Type GaN Template

Xiamen Powerway Advanced Material Co.,Ltd (PAM-XIAMEN), the leading developer and supplier of compound semiconductor crystal and wafer, today announces mass production of p type Mg doped GaN template.  
 
“Now we can offer wide range nitirde semiconductor materials,including GaN, InGaN, InN, and AlN epi wafer with a wide range of deposition rates, various type: n type, p type and semi-insulating, various doping levels, wide composition ranges, and low defect densities, to meet our various customer's requests,including researcher and device foundry",said Victor Chan, a senior marketing manager for the company.
 
The Product
 
New substrates consist of an  p-GaN layer deposited on 2-inch GaN/sapphire template.  
 
Crystal Structure:
 
p-GaN  >=2um
u-GaN   >=2um
 
Buffer layer:-
 
Sapphire  430um 
 
 
About Xiamen Powerway Advanced Material Co., Ltd
 
 
 
Found in 1990,Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of compound semiconductor material in China. PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices. PAM-XIAMEN's technologies enable higher performance and lower cost manufacturing of semiconductor wafer.
 
In 2001,PAM-XIAMEN has been involved in GaN material research.PAM-XIAMEN now offer  GaN, InGaN, InN, and AlN epitaxial products with a wide range of deposition rates, various doping levels, wide composition ranges, and low defect densities.
 
If you need more information about p-GaN wafer, please visit: http://www.powerwaywafer.com/GaN-Templates.html